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SF-20: Light-Density Silicone Foam
   
 

SF-20 is a two-part foaming elastomer that expands as it cures in place to a resilient fire resistant sealant marketed exclusively by PCI-Promatec.  The SF-20 is typically supplied as set of A and B liquid components.  The A and B liquids are black and off-white, respectively, for easy identification and inspection of complete mixing.  Installed by hand or machine, thorough mixing of the components in a 1:1 ratio yields a high dielectric liquid, that expands more 250% as it cures, resulting in a low-density, foamed elastomer at room temperature in just minutes.  It is also low in halogens, with only a mild exotherm during curing (36°F). Since it is installed as a liquid, a complete fill in and around penetrating elements is assured.  Once cured, it is an easy to modify, flexible foam, fire-resistant sealing system.

Fire Qualification
Numerous successful full-scale fire tests have been performed at nationally recognized laboratories for various seal configurations including electrical and mechanical items in large, complex openings.  Designs have been qualified for a three-hour fire resistance at a depth as little as 6” with permanent damming.  Other designs utilize 9 & 10” with damming and 12” without.

Pressure Testing
Certain configurations have been qualified for up to 3-psi pressure resistance with minimal to zero leakage.  Other configurations may vary regarding pressure resistance. 

Radiation Resistance
SF-20 has undergone substantial radiation exposure levels (1 x 108 Rads Gamma) with no significant changes reported to the material’s physical properties.

Reparability
SF-20 can be selectively removed with relative ease using blunt non-conductive tools and devices.  With minor preparation, newly installed SF-20 material becomes integral with existing SF-20.

Packaging
SF-20 is supplied in 100 lb., 80 lb. and 17 lb. sets consisting of two 6, 5 or 1-gallon containers, respectively.

Cure Time
The cure time for the SF-20 is 1 to 3 minutes, but varies with temperature.



   
   
 


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